Monday, March 20 marks the second full day, and first weekday, of the 2023 AMPP Annual Conference + Expo, which will host a number of exciting and informative symposia for attendees. Among the notable symposia taking place on Day 2 of the conference:

Bridge and Infrastructure Coatings & Corrosion: Chaired by I-Wen Huang of Abbott Laboratories and vice-chaired by Samanbar Permeh of Florida International University, this symposium features technical papers on methodologies to improve the service life of materials and structures in infrastructure, transportation, and utilities industries. Work that covers new developments and solutions for pre-stressed and post-tension reinforced concrete structures, as well as updates to existing systems such as cathodic protection, may be included.  

Corrosion Under Insulation: Chaired by Ahmad Raza Khan Rana of Integrity Products & Supplies Inc. and vice-chaired by Dr. George Jarjoura of Dalhousie University Halifax, NS, Canada, this symposium includes technical papers on corrosion under insulation (CUI), which is a driver behind 10% of overall maintenance spending in a typical oil refinery and the reason behind 40-60% of piping failures. This symposium may include papers that address the aspects of CUI and associated external damage mechanisms (e.g., stress corrosion cracking, or SCC) for thermally insulated piping., equipment, tanks, and pipelines. The papers may include, but are not limited to, testing, pilot trials, case histories, R&D results for various materials, and inspection/NDE tools, as well as various preventative measures.  

RIP—Coatings and Inhibitors: Chaired by Homero Castaneda-Lopez of Texas A&M University and vice-chaired by Nicole Kucza of GE Healthcare, this RIP symposium includes presentations on the processing, materials characterization, and performance of coatings produced by a wide variety of functionalities that encompass different manufacturing routes, including traditional and additive manufacturing. Topics of focus include new innovations in process technology, characterization, non-destructive evaluation, modeling, and emerging applications.

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